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 PROTECTION PRODUCTS - RailClamp PROTECTION PRODUCTS www..com Description
Ultra Low Capacitance TVS Arrays
PRELIMINARY Features
ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20s) IEC 61000-4-4 (EFT) 40A (5/50ns) Package design optimized for high speed lines Flow-Through design Protects two or four I/O lines Low capacitance: 0.3pF typical (I/O to I/O) Low clamping voltage Low operating voltage: 5V Solid-state silicon-avalanche technology
RCLAMP0522P RClamp0524P
RailClamps are ultra low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClampTM0522P and RClampTM0524P have a typical capacitance of only 0.30pF between I/O pins. This allows it to be used on circuits operating in excess of 3GHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). The RCLAMP0522P is designed to protect two lines, while the RClamp0524P will protect four lines. The RCLAMP0522P is in a 6-pin, RoHS/WEEE compliant, SLP1610P4 package. It measures 1.6 x 1.0 x 0.58mm. The RClamp0524P is in a 10-pin, RoHS/WEEE compliant, SLP2510P8 package. It measures 2.5 x 1.0 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. They are designed for easy PCB layout by allowing the traces to run straight through the device. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as HDMI, UDI, DisplayPortTM, MDDI, Serial ATA, and Infiniband circuits.
Mechanical Characteristics
SLP1610P4 6-pin package (1.6 x 1.0 x 0.58mm) SLP2510P8 10-pin package (2.5 x 1.0 x 0.58mm) RoHS/WEEE Compliant Lead Pitch: 0.5mm Lead finish: NiPd Marking: Marking Code Packaging: Tape and Reel per EIA 481
Applications
High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) Unified Display Interface (UDI) DisplayPortTM Interface MDDI Ports PCI Express Serial ATA
Circuit Diagram - RCLAMP0522P
Circuit Diagram - RClamp0524P
Pin 1
Pin 2
Pin 1
Pin 2
Pin 4
Pin 5
3, 4
3, 8
2-Line Protection
Revision 09/19/2006 1
4-Line Protection
www.semtech.com
PROTECTION PRODUCTS - RailClamp PROTECTION PRODUCTS www..com Pin Identification and Configuration RCLAMP0522P
6 5 4
Ultra Low Capacitance TVS Arrays
PRELIMINARY
RCLAMP0522P RClamp0524P
RClamp0524P
10 9 8 7 6
1
Pin 1-2 5-6 3-4
2
3
Identification Input Lines Output Lines (No Internal Connection) Ground Pin
1
2
3
4
5
Identification Input Lines Output Lines (No Internal Connection) Ground
1, 2, 4, 5 6, 7, 9, 10 3, 8
SLP1610P4 Pin Configuration (Top View)
SLP2510P8 Pin Configuration (Top View)
Pin 1
Pin 2
Pin 1
Pin 2
Pin 4
Pin 5
3, 4
3, 8
Circuit Diagram
Circuit Diagram
Ordering Information
Part Number RCLAMP0522P.TCT RClamp0524P.TCT Number of Lines Qty per Reel Reel Size 7 Inch 7 Inch
2 4
3000 3000
Note: Lead finish is lead-free NiPd.
RailClamp and RClamp are marks of Semtech Corporation. 2 www.semtech.com
RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS www..com Absolute Maximum Rating
Rating Peak Pulse Power (tp = 8/20s) Peak Pulse Current (tp = 8/20s) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Operating Temperature Storage Temperature Symbol Ppk IPP VESD TJ TSTG Value 150 5 +/- 17 +/- 12 -55 to +125 -55 to +150
PRELIMINARY
Units Watts A kV C C
Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage
Symbol VRWM VBR IR VC
Conditions Any I/O pin to ground It = 1mA Any I/O pin to ground VRWM = 5V, T=25C Any I/O pin to ground IPP = 1A, tp = 8/20s Any I/O pin to ground VR = 0V, f = 1MHz Between I/O pins VR = 0V, f = 1MHz Any I/O pin to ground
Minimum
Typical
Maximum 5
Units V V
6 1 15 0.30 0.4 0.8
A V pF pF
Junction Capacitance Junction Capacitance
Cj Cj
2006 Semtech Corp.
3
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RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS www..com Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
110 100 90 80 70 60 50 40 30 20 10 0
PRELIMINARY
Power Derating Curve
Peak Pulse Power - PPP (kW)
1
0.1
0.01 0.1 1 10 Pulse Duration - tp (us) 100 1000
% of Rated Power or IPP
0
25
50
75
100
o
125
150
Ambient Temperature - TA ( C)
Pulse Waveform
110 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 Time (s) 20 25 30 td = IPP/2
PP
Clamping Voltage vs. Peak Pulse Current
40
Clamping Voltage -VC (V)
Waveform Parameters: tr = 8s td = 20s e
-t
35 30 25 20 15 10 5 0 0 1 2 3 4 5 6 Peak Pulse Current - IPP (A) Waveform Parameters: tr = 8s td = 20s
Line to Gnd Line to Line
Percent of I
Normalized Capacitance vs. Reverse Voltage
1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 Reverse Voltage - VR (V) 4
ESD Clamping for +8kV pulse per IEC 61000-4-2
CJ(VR) / CJ(VR=0)
f = 1 MHz 5
2006 Semtech Corp.
4
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RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS www..com Typical Characteristics (Con't)
Insertion Loss S21 - I/O to I/O
PRELIMINARY
Insertion Loss S21 - I/O to GND
CH1 S21
LOG
6 dB / REF 0 dB 1: -0.076 dB 900 MHz
3
CH1 S21
LOG
6 dB / REF 0 dB 1: -0.086 dB 900 MHz
3
0 dB
1 2
2: -0.062 dB 1.8 GHz 3: -0.1087 dB 2.5 GHz
0 dB
1 2
2: -0.0336 dB 1.8 GHz 3: -0.126 dB 2.5 GHz
-6 dB -12 dB -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB 1 MHz START . 030 MHz 10 MHz 100 MHz
-6 dB -12 dB -18 dB -24 dB -30 dB -36 dB -42 dB
3 1 GHz GHz STOP 3000. 000000 MHz
-48 dB
1 MHz START . 030 MHz
10 MHz
100 MHz
3 1 GHz GHz STOP 3000. 000000 MHz
2006 Semtech Corp.
5
www.semtech.com
RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS www..com Applications Information
Design Recommendations for HDMI Protection Adding external ESD protection to HDMI ports can be challenging. First, ESD protection devices have an inherent junction capacitance. However, adding even a small amount of capacitance will cause the impedance of the differential pair to drop. Second, large packages and land pattern requirements cause discontinuities that adversely affect signal integrity. The RClamp0524P and RCLAMP0522P are specifically designed for protection of high-speed interfaces such as HDMI. They present <0.4pF capacitance between the pairs while being rated to handle >8kV ESD contact discharges (>15kV air discharge) as outlined in IEC 61000-4-2. Each device is in a leadless SLP package that is less than 1.1mm wide. They are designed such that the traces flow straight through the device. The narrow package and flowthrough design reduces discontinuities and minimizes impact on signal integrity. This becomes even more critical as signal speeds increase. Pin Configuration Figure 1 is an example of how to route the high speed differential traces through the RClamp0524P. The solid line represents the PCB trace. The PCB traces are used to connect the pin pairs for each line (pin 1 to pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). For example, line 1 enters at pin 1 and exits at Pin 10 and the PCB trace connects pin 1 and 10 together. This is true for lines connected at pins 2, 4, and 5 also. Ground is connected at pins 3 and 8. One large ground pad should be used in lieu of two separate pads. The same layout rules apply for the RCLAMP0522P. TDR Measurements for HDMI The combination of low capacitance, small package, and flow-through design means it is possible to use these devices to meet the HDMI impedance requirements of 100 Ohms 15% without any PCB board modification. Figures 2 and 3 show impedance test results for a TDR risetime of 200ps and 100ps respectively, using a Semtech evaluation board with 100 Ohm traces throughout. Measurements were taken using a TDR method as outlined in the HDMI Compliance Test Specification (CTS). In each case, the device meets the HDMI CTS require-
PRELIMINARY
12 11 10
1 GND GND
HDMI Connector
9 8 7
6 5 4 3 2 1
1 GND GND
Figure 1. Flow through Layout Using RClamp0524P
2006 Semtech Corp.
6
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RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS www..com Applications Information
ment of 100 Ohm 15% with plenty of margin. For signal integrity purposes, the best results will be obtained by using the RClamp0524P to protect the highspeed differential pairs. This is because the device is designed such that the data lines from the connector line up with the I/O pins of the device without altering the trace routing. Either the RCLAMP0522P or RClamp0524P may be used to protect the remaining lines (I2C, CEC, and hot plug) depending on layout constraints. Layout Guidelines for Optimum ESD Protection Good circuit board layout is critical not only for signal integrity, but also for effective suppression of ESD induced transients. For optimum ESD protection, the following guidelines are recommended: Place the device as close to the connector as possible. This practice restricts ESD coupling into adjacent traces and reduces parasitic inductance. The ESD transient return path to ground should be kept as short as possible. Whenever possible, use multiple micro vias connected directly from the device ground pad to the ground plane. Avoid running critical signals near board edges. Protecting MDDI Ports with RClamp0524P and RCLAMP0522P The small package size and low capacitance of the RCLAMP0522P and RClamp0524P make them ideal for high-speed lines in portable applications. One such application is the protection of MDDI ports in cellular phones. MDDI is a serial data interface operating at 480Mb/s per line pair. The lines are scalable for increased speed and display resolution. A MDDI port protection example is shown in Figure 4. The RClamp0524P is used to protect two differential line pairs while an RCLAMP0522P is used to protect the MDDI strobe lines. Note that devices are used on both the main board and LCD side of the MDDI port. Devices on the main board are needed to protect the MDDI controller in the Baseband processor. Devices on the LCD board are needed to protect MDDI controller in the LCD module. A TVS such as the uClamp0501P is used to protect the MDDI power line. The protection devices should be placed close to the connector of each board. Traces are routed directly through each device, minimizing parasitic inductance. Connections to the ground plane should be made with multiple micro vias when possible.
2006 Semtech Corp. 7
PRELIMINARY
B
A
X-axis Y-axis
A 1.905 101.0
B 2.081 107.0
(nsec) (Ohm)
Figure 2 - TDR Measurement with 200ps risetime using Semtech Evaluation Board
B
A
X-axis Y-axis
A 1.80 96
B 2.076 108.0
(nsec) (Ohm)
Figure 3 - TDR Measurement with 100ps risetime using Semtech Evaluation Board
www.semtech.com
RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS www..com Applications Information PRELIMINARY
MDDI_Data0+ MDDI_Data0Gnd MDDI_Data1+ MDDI_Data1Gnd
MDDI Link Controller
MDDI Link Controller
RClamp0524P
RClamp0524P
MDDI_Stb+ MDDI_StbGnd RCLAMP0522P Hos t Pw r Hos t Gnd uClamp0501P
Gnd RCLAMP0522P
HOST
uClamp0501P
DISPLAY
Figure 4. MDDI Port Protection
2006 Semtech Corp.
8
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RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS
www..com Applications Information Spice Model
PRELIMINARY
RCLAMP0522P Spice Model
RCLAMP0522P Spice Parameters Parameter IS BV VJ RS IBV CJO TT M N EG
2006 Semtech Corp.
Unit Amp Volt Volt Ohm Amp Farad sec --eV
9
D1 1E-20 100 0.7 0.458 1E-3 0.6E-12 2.541E-9 0.01 1.1 1.11
D2 (LCRD) 1E-20 100 0.7 1.0 1E-3 0.6E-12 2.541E-9 0.01 1.1 1.11
D3 (TVS) 2E-12 9.36 0.6 2.6 1E-3 56E-12 2.541E-9 0.23 1.1 1.11
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RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS
www..com Applications Information Spice Model
PRELIMINARY
RClamp0524P Spice Model
RClamp0524P Spice Parameters Parameter IS BV VJ RS IBV CJO TT M N EG
2006 Semtech Corp.
Unit Amp Volt Volt Ohm Amp Farad sec --eV
D1 1E-20 100 0.7 0.458 1E-3 0.6E-12 2.541E-9 0.01 1.1 1.11
10
D2 (LCRD) 1E-20 100 0.7 1.0 1E-3 0.6E-12 2.541E-9 0.01 1.1 1.11
D3 (TVS) 2E-12 9.36 0.6 2.6 1E-3 56E-12 2.541E-9 0.23 1.1 1.11
www.semtech.com
RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS www..com Outline Drawing SO-8 Outline Drawing -- SLP1610P4
A D B
PRELIMINARY
DIM
PIN 1 INDICATOR (LASER MARK) E
A A1 A2 b b1 D E e L N aaa bbb
A aaa C A2 bbb bxN CAB 1 E/2 LxN 2 A1 C
SEATING PLANE
.020 .023 .026 0.00 .001 .002 (.005) .006 .008 .010 .014 .016 .018 .059 .063 .067 .035 .039 .043 .020 BSC .012 .015 .017 6 .003 .004
DIME NS IONS INCHE S MILLIME T E RS MIN NOM MA X MIN NOM MA X
0.50 0.58 0.65 0.00 0.03 0.05 (0.13) 0.15 0.20 0.25 0.35 0.40 0.45 1.50 1.60 1.70 0.90 1.00 1.10 0.50 BSC 0.30 0.38 0.425 6 0.08 0.10
b1xN bbb R0.125
CAB
2X R0.075 3 PLACES
N e D/2
NOT E S :
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1610P4
P1 P
DIMENSIONS
Y Z (C) G (Y1)
X X1
DIM C G P P1 X X1 Y Y1 Z
INCHES (.034) .008 .020 .039 .008 .016 .027 (.061) .061
MILLIMET ERS (0.875) 0.20 0.50 1.00 0.20 0.40 0.675 (1.55) 1.55
NOT ES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2006 Semtech Corp.
11
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RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS www..com Outline Drawing SO-8 Outline Drawing -- SLP2510P8
A D B
PRELIMINARY
DIM
PIN 1 INDICATOR (LASER MARK) E
A A1 A2 b b1 D E e L N aaa bbb
A aaa C A2 R0.125 1 E/2 LxN 2 A1 b1xN bbb C
SEATING PLANE
.020 .023 .026 0.00 .001 .002 (.005) .006 .008 .010 .014 .016 .018 .094 .098 .102 .035 .039 .043 .020 BSC .012 .015 .017 10 .003 .004
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
0.50 0.58 0.65 0.00 0.03 0.05 (0.13) 0.15 0.20 0.25 0.35 0.40 0.45 2.40 2.50 2.60 0.90 1.00 1.10 0.50 BSC 0.30 0.38 0.425 10 0.08 0.10
CAB
N e D/2
2X R0.075 7 PLACES bxN bbb CAB
NOTES:
1. CO NTRO LLING DIMENSIO NS ARE IN MILLIMETERS (ANG LES IN DEGREES). 2. CO PLANARITY APPLIES TO THE EXPO SED PAD AS W ELL AS THE TERMINALS.
Land Pattern - SLP2510P8
P1 P
DIMENSIONS DIM C G P P1 X X1 Y Y1 Z INCHES (.034) .008 .020 .039 .008 .016 .027 (.061) .061 MILLIMET ERS (0.875) 0.20 0.50 1.00 0.20 0.40 0.675 (1.55) 1.55
Y Z (C) G (Y1)
X X1
NOT ES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2006 Semtech Corp.
12
www.semtech.com
RCLAMP0522P RClamp0524P
PROTECTION PRODUCTS
www..com Marking Codes
PRELIMINARY
RClamp0524P
RCLAMP0522P
PIN 1 INDICAT O R
0522P
PIN 1 IND ICATOR
0524P
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
Part Number RCLAMP0522P RClamp0524P
A0 1.12 +/-0.05 mm 1.23 +/-0.05 mm
B0 1.30 +/-0.05 mm 2.70 +/-0.05 mm
K0 0.76 +/-0.05 mm 0.70 +/-0.05 mm
Tape Width
B, (Max)
D
D1
E
F
K (MAX)
P
P0
P2
T(MAX)
W 8.0 mm + 0.3 mm - 0.1 mm
8 mm
4.2 mm
1.5 + 0.1 mm - 0.0 mm )
0.5 mm 0.05
1.750.10 mm
3.50.05 mm
2.4 mm
4.00.1 mm
4.00.1 mm
2.00.05 mm
0.4 mm
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
2006 Semtech Corp. 13 www.semtech.com


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